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BOND LAB TECHNOLOGIES, INC.

Company Details

Entity Name: BOND LAB TECHNOLOGIES, INC.
Jurisdiction: Illinois
Entity Type: Corporation - Domestic BCA
Status: Dissolved
Date Formed: 09 Mar 2015
Date of Dissolution: 12 Aug 2022
Company Number: CORP_70045001
File Number: 70045001
Type of Business: All Inclusive Purpose
Date Status Change: 12 Aug 2022
Place of Formation: ILLINOIS

Agent

Name and Address Role Appointment Date
SA LAW AGENTS, INC., 150 N MICHIGAN AVE STE 3300, CHICAGO, 60601, COOK-NOT IN CITY OF CHICAGO Agent 2015-03-09

President

Name and Address Role
GLENN M. SCHULTZ, 1471 MIDWAYLN GLENVIEW IL 60026 President

Shares

Class Series Voting Rights Authorized Shares Issued Shares Par Value
COMMON No data Voting Rights 10000 1000000 No data

Date of last update: 13 Feb 2025

Sources: Illinois Office of the Secretary of State