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  5. WHI MORULA FUND, LLC

WHI MORULA FUND, LLC

Company Details

Entity Name: WHI MORULA FUND, LLC
Jurisdiction: Illinois
Entity Type: Limited Liability Company
Status: Voluntary Diss./Terminated
Date Formed: 18 Aug 2003
Date of Dissolution: 01 Aug 2023
Company Number: LLC_00983845
File Number: 00983845
Type of Management: Manager Managed
Date Status Change: 20 Dec 2017
Address 191 N. WACKER DR., STE. 1500, CHICAGO, 60606, IL
Place of Formation: ILLINOIS

Unique Entity ID

Unique Entity ID Expiration Date Physical Address Mailing Address
JUAHXELVYXX4 2022-08-01 615 STETSON AVE, SAINT CHARLES, IL, 60174, 3458, USA 615 STETSON AVE, SAINT CHARLES, IL, 60174, 3458, USA

Business Information
Congressional District 06
State/Country of Incorporation IL, USA
Activation Date 2021-07-06
Initial Registration Date 2019-05-23
Entity Start Date 1977-01-31
Fiscal Year End Close Date Dec 31

Service Classifications
NAICS Codes 333511, 333517

Points of Contacts
Electronic Business
Title PRIMARY POC
Name MIKE YORK
Address 615 STETSON AVE, ST CHARLES, IL, 60174, USA
Government Business
Title PRIMARY POC
Name MIKE YORK
Address 615 STETSON AVE, ST CHARLES, IL, 60174, USA
Past Performance Information not Available

Central Index Key

CIK number Mailing Address Business Address Phone
1265105 No data 2 N LASALLE ST, STE 400, CHICAGO, IL, 60602 312-621-0690

Filings since 2003-09-26
Form type REGDEX
File number 021-58938
Filing date 2003-09-26
File View File

form 5500

Plan Name Plan Year EIN/PN Received Sponsor Total number of participants
CME THRIFT PLAN 2012 362086834 2013-07-05 CHICAGO MOLD ENGINEERING CO.,INC. 77
File View Page
Three-digit plan number (PN) 003
Effective date of plan 1979-02-01
Business code 332900
Sponsor’s telephone number 6305841311
Plan sponsor’s address 615 STETSON AVENUE, ST. CHARLES, IL, 60174

Plan administrator’s name and address
Administrator’s EIN 362086834
Plan administrator’s name CHICAGO MOLD ENGINEERING CO.,INC.
Plan administrator’s address 615 STETSON AVENUE, ST. CHARLES, IL, 60174
Administrator’s telephone number 6305841311

Signature of
Role Plan administrator
Date 2013-07-05
Name of individual signing BRIAN T. HISEL
Valid signature Filed with authorized/valid electronic signature
CME THRIFT PLAN 2011 362086834 2012-08-29 CHICAGO MOLD ENGINEERING CO.,INC. 70
File View Page
Three-digit plan number (PN) 003
Effective date of plan 1979-02-01
Business code 332900
Sponsor’s telephone number 6305841311
Plan sponsor’s address 615 STETSON AVENUE, ST. CHARLES, IL, 60174

Plan administrator’s name and address
Administrator’s EIN 362086834
Plan administrator’s name CHICAGO MOLD ENGINEERING CO.,INC.
Plan administrator’s address 615 STETSON AVENUE, ST. CHARLES, IL, 60174
Administrator’s telephone number 6305841311

Signature of
Role Plan administrator
Date 2012-08-29
Name of individual signing BRIAN HISEL
Valid signature Filed with authorized/valid electronic signature
CME THRIFT PLAN 2010 362086834 2011-05-26 CHICAGO MOLD ENGINEERING CO., INC. 72
File View Page
Three-digit plan number (PN) 003
Effective date of plan 1979-02-01
Business code 332900
Sponsor’s telephone number 6305841311
Plan sponsor’s address 615 STETSON AVENUE, ST. CHARLES, IL, 60174

Plan administrator’s name and address
Administrator’s EIN 362086834
Plan administrator’s name CHICAGO MOLD ENGINEERING CO., INC.
Plan administrator’s address 615 STETSON AVENUE, ST. CHARLES, IL, 60174
Administrator’s telephone number 6305841311

Signature of
Role Plan administrator
Date 2011-05-26
Name of individual signing THOMAS E. HEINDL
Valid signature Filed with authorized/valid electronic signature
Role Employer/plan sponsor
Date 2011-05-26
Name of individual signing THOMAS E. HEINDL
Valid signature Filed with authorized/valid electronic signature
CME THRIFT PLAN 2009 362086834 2010-07-18 CHICAGO MOLD ENGINEERING CO., INC. 71
File View Page
Three-digit plan number (PN) 003
Effective date of plan 1979-02-01
Business code 332900
Sponsor’s telephone number 6305841311
Plan sponsor’s address 615 STETSON AVENUE, ST. CHARLES, IL, 60174

Plan administrator’s name and address
Administrator’s EIN 362086834
Plan administrator’s name CHICAGO MOLD ENGINEERING CO., INC.
Plan administrator’s address 615 STETSON AVENUE, ST. CHARLES, IL, 60174
Administrator’s telephone number 6305841311

Signature of
Role Plan administrator
Date 2010-06-28
Name of individual signing THOMAS E. HEINDL
Valid signature Filed with authorized/valid electronic signature
Role Employer/plan sponsor
Date 2010-06-28
Name of individual signing THOMAS E. HEINDL
Valid signature Filed with authorized/valid electronic signature
CME THRIFT PLAN 2009 362086834 2010-06-28 CHICAGO MOLD ENGINEERING CO., INC. 71
Three-digit plan number (PN) 003
Effective date of plan 1979-02-01
Business code 332900
Sponsor’s telephone number 6305841311
Plan sponsor’s address 615 STETSON AVENUE, ST. CHARLES, IL, 60174

Plan administrator’s name and address
Administrator’s EIN 362086834
Plan administrator’s name CHICAGO MOLD ENGINEERING CO., INC.
Plan administrator’s address 615 STETSON AVENUE, ST. CHARLES, IL, 60174
Administrator’s telephone number 6305841311

Signature of
Role Plan administrator
Date 2010-06-28
Name of individual signing THOMAS E. HEINDL
Valid signature Filed with authorized/valid electronic signature
Role Employer/plan sponsor
Date 2010-06-28
Name of individual signing THOMAS E. HEINDL
Valid signature Filed with authorized/valid electronic signature

Agent

Name and Address Role Appointment Date
JACK POLSKY, 191 N. WACKER DR., STE. 1500, CHICAGO, 60606 Agent 2004-09-30

Manager

Name and Address Role Appointment Date
WILLIAM HARRIS INVESTORS INC 5509 530 2, 191 N WACKER DR STE 1500, CHICAGO, IL, 60602 Manager 2017-07-13

Related by officers

No related officers

Related by address

191 N. WACKER DR., STE. 1500, CHICAGO, 60606, IL

HARRIS SL II LIMITED LIABILITY COMPANY SB HOLDING, LLC HARRIS VENTURE PARTNERS L.L.C. WHI REALTY FUND, LLC WHI FIXED INCOME FUND, LLC WHI MILLENNIUM PARTNERS, LLC WHI FIXED INCOME FUND II, LLC

Date of last update: 23 Jan 2025

Sources: Illinois Office of the Secretary of State

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